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3D IC technology may reduce form factor and power consumption and increase bandwidth
July 8, 2013
By: DAVID SAVASTANO
Editor, Ink World Magazine
Dow Corning announced that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures. “This move is a natural and strategic step for Dow Corning and imec, as we both believe co...
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